Mwc 2020 Realme X50 Pro 5G With Punch Hole Camera Snapdragon 865 Launches February 24

Earlier last week, Realme revealed that it will launch a 5G smartphone at MWC 2020. The company also teased that it will be their next flagship – the Realme X50 Pro 5G – with the latest Snapdragon 865 chipset and a dual-camera punch-hole system. Well, Realme has today confirmed the launch date for its 5G-enabled flagship smartphone.

Thanks to a screenshot shared by Realme China CMO Xu Qi Chase, we already know the key internal specs for the Realme X50 Pro 5G. It’s confirmed to come equipped with the Snapdragon 865 chipset and Snapdragon X55 5G modem.

Though we haven’t gotten a good look at the front or rear, the screenshot also hints at a Full-HD+ display with a 1080 x 2400pixel resolution and a 20:9 aspect ratio. Apart from this, we expect the display to be an AMOLED panel with a 120Hz refresh rate. The flagship smartphone will look similar to its younger sibling, the Realme X50, only with an upgraded panel.